In recent decades, attempts have been made to create more advanced effective cooling technology for electronic and microelectronic devices, but heat dissipation is still a major challenge for increasing the cooling performance of heat sinks in a highly competitive electronics market. In the present analysis, the research is designing a new thermal design for plate-fin heat sinks with hexagonal pin fin connected to the plate-fins. A theoretical analysis focused on publicly usable computational fluid dynamics (CFD) codes has been performed to test the thermal efficiency of the proposed designs. Modelling done using ANSYS 14.5 and meshing has done using ICEM CFD software, simulations has done by using CFD-FLUENT software. In specific, in terms of their thermal performance, hexagonal pin fin connected to the plate-fins subject to flow have been contrasted. The plate-fin heat sink was made of Aluminium and an electrical heaters provide a heat of 10W constantly to warm up a plate-plate-fin heat sink with hexagonal pin fin subject to flow of air at variable values (i.e. 6.5, 9.5, and 2.5 m/s).Based on the results, the analysis has shown that the plate-fin heat sinks demonstrate superior thermal performance with hexagonal 3-pin fin subject to flow. The Nusselt number is approximately 1.32 times higher than the conventional plate-fin heat sink without pin fin and 1.13 times higher than plate-fin heat sink with elliptical 3-pin fin.
Heat sink; Pin fin; Hexagonal Pin fin; Nusselt number; Pressure drop; Base Temperature and Computational fluid dynamics
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